MESSAGE


HOME   /   Synova Lgs Laser Edge Grinding Machines

Synova Lgs Laser Edge Grinding Machines


3-axis machine: 2D cutting, drilling, slicing, grooving 5-axis machine: 3D shaping, cutting, drilling, slicing, edge grinding (K-land edges, single or multiple clearance angles), grooving, milling, chip breaker trenching, engraving, profiling The LCS 50 is Synova’s most compact and cost-efficient Laser MicroJet® (LMJ) machine. The LCS 50 is

Company Scale

scaleBg
  • Laser Cutting System Saiimpexindiacom

    Laser Cutting System Saiimpexindiacom

    3-axis machine: 2D cutting, drilling, slicing, grooving 5-axis machine: 3D shaping, cutting, drilling, slicing, edge grinding (K-land edges, single or multiple clearance angles), grooving, milling, chip breaker trenching, engraving, profiling The LCS 50 is Synova’s most compact and cost-efficient Laser MicroJet® (LMJ) machine. The LCS 50 is

    Get Details
  • Cutting Diamond Tools By Laser MicroJet Drupal

    Cutting Diamond Tools By Laser MicroJet Drupal

    The Synova LCS 50-5 laser machining process delivers an extremely fine surface finish (Ra ≤ 0,3 micron) for PCD tools, which eliminates the need for a second grinding operation. In addition, the machine’s 5-axis capability is in a position to execute CNC programs with the high degree of precision needed for such cutting tools.

    Get Details
  • LDS 300 A Plastic Cutting Machine Fiber Laser Wafer

    LDS 300 A Plastic Cutting Machine Fiber Laser Wafer

    Find out all of the information about the Synova product: plastic cutting machine / fiber laser / wafer / CNC LDS 300 A. Contact a supplier or the parent company directly to get a quote or to find out a price or your closest point of sale.

    Get Details
  • Synovas Success Electronics Case Study Matrox

    Synovas Success Electronics Case Study Matrox

    The machines on offer use the water-jet-guided laser technology (also called Laser-Microjet) for various micro-machining operations such as wafer dicing and edge grinding for the semiconductor industry, and cutting of hard materials such as CBN and PCD, PV solar

    Get Details
  • Synova Receives Multiplesystem Orders From Korean

    Synova Receives Multiplesystem Orders From Korean

    January 31--Synova announced tool orders from a Korean organic light-emitting diode (OLED) manufacturer and a leading U.S.-based semiconductor manufacturers Korean facility.The first order was placed for the companys Laser Stenciling System, LSS 1200, for OLED mask manufacturing, and the second for the companys Laser Grinding System, LGS 200A, for thin wafer edge grinding.

    Get Details
  • Synova And Disco HiTec Europe Codevelop Hybrid Dicing

    Synova And Disco HiTec Europe Codevelop Hybrid Dicing

    Jun 14, 2007 · LAUSANNE, Switzerland and MUNICH, Germany -- In a move that will greatly broaden global access to its innovative water jet-guided laser technology, Synova today revealed it has entered into a partnership with Munich-based DISCO HI-TEC EUROPE GmbH -- a subsidiary of DISCO Corporation, the leading provider of semiconductor wafer dicing, grinding

    Get Details
  • Laser MicroJet Technology Hasmaktcom

    Laser MicroJet Technology Hasmaktcom

    Synova S.A., headquartered in Duillier, Switzerland, manufactures leading-edge laser cutting systems since 1997 that incorporate the proprietary water jet guided laser technology (laser ®) in a true industrial CNC microJet platform. Customers benefit from significant yield and quality improvements in cutting, as well as enhanced

    Get Details
  • Laser Cutting Systems Synova PDF Catalogs Technical

    Laser Cutting Systems Synova PDF Catalogs Technical

    Moreover, high axis speeds are possible, reaching 1000 mm/s. In particular, cutting speeds for thin materials (i.e., 50-um thick silicon) have topped 300mm/s running through the silicon in one pass. Laser Cutting System il i The Laser Microjet Contained within a hair-thin water jet through total internai Open the catalog to page 2

    Get Details
  • Laser Machines For Cutting Edge Processing Drupal

    Laser Machines For Cutting Edge Processing Drupal

    EDM machines; EDM wire; Laser processing . Laser machines for chip breaker production; Laser machines for creating blank cuts; Laser machines for cutting edge processing; Laser marking; Marking as a service; Materials for tool production . Blanks for HSS tools; Blanks for tungsten carbide tools; CBN powder / grit; CVD diamond; Carbon wheel

    Get Details
  • S Metal Watches EPMT2015englishswissphotonics

    S Metal Watches EPMT2015englishswissphotonics

    Synova Confidential Laser Microjet Laser Edge-Grinding System (LGS) with DIT Hybrid Laser Saw (HLS) with Disco (DCS) Laser Drilling System with Posalux Cutting of diamonds Machines with Manufacturing Partners Laser Cutting System (MCS) with Makino Tool Cutting / Turbine Drilling System (TCS / TDS 250) with Willemin-Macodel.

    Get Details
  • Synova Lands CHF20 Million Venture Investment Opticsorg

    Synova Lands CHF20 Million Venture Investment Opticsorg

    * Article updated October 13 Holland Private Equity (HPE), an investment group backed by a major European pension fund manager and also the European Investment Fund, has become the largest external shareholder in Synova, the Swiss company that specializes in a novel Nd:YAG laser-machining technique using a water-jet as a beam guide. The investment, said to be worth “up to” CHF20 million

    Get Details
  • Laser Cutting System Saiimpexindiacom

    Laser Cutting System Saiimpexindiacom

    3-axis machine: 2D cutting, drilling, slicing, grooving 5-axis machine: 3D shaping, cutting, drilling, slicing, edge grinding (K-land edges, single or multiple clearance angles), grooving, milling, chip breaker trenching, engraving, profiling The LCS 50 is Synova’s most compact and cost-efficient Laser MicroJet® (LMJ) machine. The LCS 50 is

    Get Details
  • LDS 300 A Plastic Cutting Machine Fiber Laser Wafer

    LDS 300 A Plastic Cutting Machine Fiber Laser Wafer

    Find out all of the information about the Synova product: plastic cutting machine / fiber laser / wafer / CNC LDS 300 A. Contact a supplier or the parent company directly to get a quote or to find out a price or your closest point of sale.

    Get Details
  • Synova Launches UltraPrecise Laser Machining Center LCS 305

    Synova Launches UltraPrecise Laser Machining Center LCS 305

    5-Axis Laser MicroJet® cutting system designed to handle sophisticated 3-D applications in tool and aerospace industries Synova, a Swiss-based provider of advanced laser cutting systems, is launching a new CNC machine with full 5-axis capability to process complex three-dimensional geometries.

    Get Details
  • Synova Makino Offer LMJEDM HybridCell Cutting Tool

    Synova Makino Offer LMJEDM HybridCell Cutting Tool

    To address this need, Synova and Makino are joining forces to offer a unique solution, the HybridCell, which combines the power of Synova’s Laser MicroJet ® (LMJ) with Makino’s leading edge EDM capabilities. It is a fully automated, manufacturing-ready, work cell that can handle a wide range of hole-drilling applications.

    Get Details
  • Grinding Machine With Laser Loofamsterdamnl

    Grinding Machine With Laser Loofamsterdamnl

    Manufacturing Engineering - United Grinding Focuses New Laser ,- grinding machine with laser ,3 Mar 2015 , The design allows toolmakers to laser machine a tools cutting edges as well as laser ablate its complex step chipbreakers in one machine clamping The ultra- short pulse laser technology directly vaporizes materials without.NTC LTD | Japan Machine Tool Builders AssociationCylindrical

    Get Details
  • LCS50 Sai Impex

    LCS50 Sai Impex

    The LCS 50 is Synova’s most compact and cost-efficient Laser MicroJet® (LMJ) machine. The LCS 50 is designed for machining industrial diamond tools and other small work pieces that require precision cutting, drill- ling, grooving or slicing.

    Get Details
  • Synova Receives MultipleSystem Orders From Korean OLED

    Synova Receives MultipleSystem Orders From Korean OLED

    The first order was placed for Synovas Laser Stenciling System, LSS 1200, for OLED mask manufacturing, and the second for the companys Laser Grinding System, LGS 200A, for thin-wafer edge grinding. Both orders mark Synovas penetration into the Korean market, and ultimately, the increased adoption of its Laser MicroJet® for leading-edge

    Get Details
  • GaAsWafer Dicing Using The Water Jet Guided Laser

    GaAsWafer Dicing Using The Water Jet Guided Laser

    Synova SA, Ch. De la Dent-d’Oche, 1024 Ecublens, Switzerland E-mail: [email protected] / Phone: +41 21 694 35 00 / Fax: +41 21 694 35 01 Keywords: laser cutting, water jet guided laser, GaAs, compound semiconductors, thin wafer dicing, edge grinding Abstract Semiconductor wafers

    Get Details
  • Cutting Diamond Tools Using The Laser MicroJet Technology

    Cutting Diamond Tools Using The Laser MicroJet Technology

    Cutting diamond tools using the Laser MicroJet® technology on a 5-axis machine A. Richmann, S. Kurzen, B. Carron, B. Richerzhagen Synova SA, Chemin de la Dent d’Oche, 1024 Ecublens, Switzerland Abstract The Laser MicroJet® technology uses a water coupled ns-laser to cut various materials e.g. diamond, semiconductors, ceramics and metals.

    Get Details
  • Inauguration Of Laser MicroJet Demo Center Todays

    Inauguration Of Laser MicroJet Demo Center Todays

    Oct 20, 2014 · Atsugi, Japan – Synova officials announced a new milestone in its strategic cooperation with Makino – the opening of a new Laser MicroJet (LMJ) demo center located in the building of the Makino Atsugi Factory. Representing Synovas largest demo facility up to now, three LMJ systems will be available for demonstrating the technology and showing the capabilities of the machine.

    Get Details
  • Curlie Business Industrial Goods And Services

    Curlie Business Industrial Goods And Services

    Switzerland. Design and manufacture of waterjet guided and fully automatic laser dicing and edge grinding systems for the semiconductor, electronic, medical, energy, and automotive industries. Introduction to technology. Extensive technical information. Multi-lingual library of technical articles and calendar of events on PDF files.

    Get Details
  • Compact Lasermicrojet Cutting System With Up To 5 Axes

    Compact Lasermicrojet Cutting System With Up To 5 Axes

    Jun 30, 2015 · Lausanne, Switzerland – Officials from Synova, a provider of advanced laser cutting solutions, are launching the company’s new LCS 50 machine, designed for machining diamond tools, medical components, watch components, and other small workpieces.The ultra-compact LCS 50 is available in a 3- or 5-axis configuration, offering fast cutting times, easy processing, and high precision

    Get Details
  • LCS50 Sai Impex

    LCS50 Sai Impex

    The LCS 50 is Synova’s most compact and cost-efficient Laser MicroJet® (LMJ) machine. The LCS 50 is designed for machining industrial diamond tools and other small work pieces that require precision cutting, drill- ling, grooving or slicing.

    Get Details
  • Synova Lands CHF20 Million Venture Investment Opticsorg

    Synova Lands CHF20 Million Venture Investment Opticsorg

    * Article updated October 13 Holland Private Equity (HPE), an investment group backed by a major European pension fund manager and also the European Investment Fund, has become the largest external shareholder in Synova, the Swiss company that specializes in a novel Nd:YAG laser-machining technique using a water-jet as a beam guide. The investment, said to be worth “up to” CHF20 million

    Get Details
  • Synova Receives MultipleSystem Orders From Korean OLED

    Synova Receives MultipleSystem Orders From Korean OLED

    The first order was placed for Synovas Laser Stenciling System, LSS 1200, for OLED mask manufacturing, and the second for the companys Laser Grinding System, LGS 200A, for thin-wafer edge grinding. Both orders mark Synovas penetration into the Korean market, and ultimately, the increased adoption of its Laser MicroJet® for leading-edge

    Get Details
  • Synova Makino Offer LMJEDM HybridCell Cutting Tool

    Synova Makino Offer LMJEDM HybridCell Cutting Tool

    To address this need, Synova and Makino are joining forces to offer a unique solution, the HybridCell, which combines the power of Synova’s Laser MicroJet ® (LMJ) with Makino’s leading edge EDM capabilities. It is a fully automated, manufacturing-ready, work cell that can handle a wide range of hole-drilling applications.

    Get Details
  • Synova Launches UltraPrecise Laser Machining Center LCS 305

    Synova Launches UltraPrecise Laser Machining Center LCS 305

    5-Axis Laser MicroJet® cutting system designed to handle sophisticated 3-D applications in tool and aerospace industries Synova, a Swiss-based provider of advanced laser cutting systems, is launching a new CNC machine with full 5-axis capability to process complex three-dimensional geometries.

    Get Details
  • Synovas Success Electronics Case Study

    Synovas Success Electronics Case Study

    The machines on offer use the water-jet-guided laser technology (also called Laser-Microjet) for various micro-machining operations such as wafer dicing and edge grinding for the semiconductor industry, and cutting of hard materials such as CBN and PCD, PV solar

    Get Details
  • Laser Machining Of Diamond Tools Industrcom

    Laser Machining Of Diamond Tools Industrcom

    May 17, 2017 · 5-axis laser machining The Synova LCS 50-5 laser cutting system (working area: 50 x 50 x 50 mm) can cut extremely hard materials with highest precision. It is a compact machine with 5-axis capability with a user-friendly interface and intuitive CAM software for

    Get Details
  • Laser MicroJet Technology Hasmaktcom

    Laser MicroJet Technology Hasmaktcom

    Synova S.A., headquartered in Duillier, Switzerland, manufactures leading-edge laser cutting systems since 1997 that incorporate the proprietary water jet guided laser technology (laser ®) in a true industrial CNC microJet platform. Customers benefit from significant yield and quality improvements in cutting, as well as enhanced

    Get Details
  • Wirtschaftch Synova SA Ecublens Waadt Kompetenzmarkt

    Wirtschaftch Synova SA Ecublens Waadt Kompetenzmarkt

    Laser Dicing System (LDS) The Laser Dicing System is primarily designed for semiconductor wafer back-end processing. Processes include dicing, edge grinding, hole drilling, slotting, grooving, inking, isolating, and marking. The LDS is also used for the cutting of solar PV cells. Laser Stencil System (LSS)

    Get Details
  • Curlie Business Industrial Goods And Services

    Curlie Business Industrial Goods And Services

    Switzerland. Design and manufacture of waterjet guided and fully automatic laser dicing and edge grinding systems for the semiconductor, electronic, medical, energy, and automotive industries. Introduction to technology. Extensive technical information. Multi-lingual library of technical articles and calendar of events on PDF files.

    Get Details
  • Inauguration Of Laser MicroJet Demo Center Todays

    Inauguration Of Laser MicroJet Demo Center Todays

    Oct 20, 2014 · Atsugi, Japan – Synova officials announced a new milestone in its strategic cooperation with Makino – the opening of a new Laser MicroJet (LMJ) demo center located in the building of the Makino Atsugi Factory. Representing Synovas largest demo facility up to now, three LMJ systems will be available for demonstrating the technology and showing the capabilities of the machine.

    Get Details
  • How Really Hard Is Hard Industrial Laser Solutions

    How Really Hard Is Hard Industrial Laser Solutions

    For cutting hard materials, machines with processing tables of 300 × 300 mm are available with cutting speeds of up to 1000 mm/s, an absolute precision of ±3 µm, and repeatability of ±1 µm. The LMJ machining capabilities were carried out using Synova’s Laser Cutting System LCS 300 machine

    Get Details
  • Cutting Diamond Tools Using The Laser MicroJet Technology

    Cutting Diamond Tools Using The Laser MicroJet Technology

    Cutting diamond tools using the Laser MicroJet® technology on a 5-axis machine A. Richmann, S. Kurzen, B. Carron, B. Richerzhagen Synova SA, Chemin de la Dent d’Oche, 1024 Ecublens, Switzerland Abstract The Laser MicroJet® technology uses a water coupled ns-laser to cut various materials e.g. diamond, semiconductors, ceramics and metals.

    Get Details
  • Edge Runner For Mica Grinding China Alterfritzinpollede

    Edge Runner For Mica Grinding China Alterfritzinpollede

    Edge runner milling machine for small alluvial gold mine. edge runner mill for mica grinding Grinding Mill China. HomeProductsMTW Milling Machineedge runner mill for mica edge runner mill for mica grinding. edge runner mill

    Get Details
  • Laser Micromachining In Microelectronic Industry By Water

    Laser Micromachining In Microelectronic Industry By Water

    Laser micro-machining in microelectronic industry by water jet guided laser O. Sibailly*, F. Wagner, B. Richerzhagen Synova SA, Ch. De la Dent d’Oche, CH-1024 Ecublens, Switzerland

    Get Details
  • Compact Lasermicrojet Cutting System With Up To 5 Axes

    Compact Lasermicrojet Cutting System With Up To 5 Axes

    Jun 30, 2015 · Lausanne, Switzerland – Officials from Synova, a provider of advanced laser cutting solutions, are launching the company’s new LCS 50 machine, designed for machining diamond tools, medical components, watch components, and other small workpieces.The ultra-compact LCS 50 is available in a 3- or 5-axis configuration, offering fast cutting times, easy processing, and high precision

    Get Details

Related Post